Package for parallel subelement semiconductor devices

Details Package for parallel subelement semiconductor devices Package for parallel subelement semiconductor devices

1994-01-06

1995-12-05

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 257724, H01L 2348

Patent

active

054731933

ABSTRACT:
A package for semiconductor devices with plural subelements and method of packaging. Semiconductor power devices may include plural subelements to increase device manufacturing yield. Each subelement is separately contacted through the lid of the package by attaching a foil to a subelement contact and depending a tab from the foil that extends through the lid. Tabs for operative subelements can be connected external to the package, and tabs for inoperative subelements may be left unconnected or covered so that electrical connections cannot be made therewith.

REFERENCES:
patent: 4007452 (1977-02-01), Hoff, Jr.
patent: 4984051 (1991-01-01), Yoshida
W. Scot Ruska, Ph.D., Microelectronic Processing, An Introduction to the Manufacture of Integrated Circuits, 1987, pp. 9 & 12.

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