Wafer joined optoelectronic integrated circuits and method

Details Wafer joined optoelectronic integrated circuits and method Wafer joined optoelectronic integrated circuits and method

1994-07-14

1995-12-05

Picardai, Kevin M.

Fishing, trapping, and vermin destroying

437 2, 437 3, 437974, 148DIG135, H01L 2160

Patent

active

054729149

ABSTRACT:
A full wafer to full wafer integrated circuit fabrication process wherein substrate removal and replacement of one wafer is used to enable an accurate alignment of this wafer with features of a receiving wafer during a see through alignment step. The invention is disclosed in terms of a wafer of photo field effect transistors being combined with a wafer of circuit devices that attend the photo field effect transistor devices. Use of the invention with the different material combination option desired for a photodetector device and its attending circuitry is also disclosed. Advantages over the more conventional chip by chip combination of wafer devices are also disclosed.

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