Process for formation of vias (or contact openings) and fuses in

Details Process for formation of vias (or contact openings) and fuses in Process for formation of vias (or contact openings) and fuses in

1994-12-02

1995-12-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437195, 437922, 148DIG55, H01L 2170, H01L 2700

Patent

active

054729017

ABSTRACT:
A process and resulting product are described for forming an integrated circuit structure with horizontal fuses on an insulation layer formed over other portions of the integrated circuit structure by forming rectangular recesses in the insulation layer which are subsequently filled during a subsequent metal deposition step which also serves to fill with the same metal vias or contact openings which have been etched through the insulation layer. Subsequent planarization of the deposited metal layer down to the vias or contact openings, i.e. to remove the portions of the metal layer over the insulation layer, leaves the metal in the vias or contact openings and also leaves metal stringers on the sidewalls of the rectangular recess which then serve as fusible links (fuses) which are then connected to one or more metal lines thereafter formed on the insulation layer.

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patent: 5244836 (1993-09-01), Lim

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