Resistor under wirebond pad

Details Resistor under wirebond pad Resistor under wirebond pad

1989-10-23

1991-11-19

Laroche, Eugene R.

357 71, 357 2313, H01L 2702

Patent

active

050669990

ABSTRACT:
A preferred embodiment of the invention is a poly input resistor located underneath, rather than alongside, an IC wirebond pad. This offers the advantages of a more efficient layout, more contacts connecting the pad to the resistor, a better contact configuration, and a larger, higher current resistor.

REFERENCES:
patent: 4695870 (1987-09-01), Patraw
patent: 4710791 (1987-12-01), Shirato et al.
patent: 4771294 (1988-09-01), Wasilousky
patent: 4807080 (1989-02-01), Clark
patent: 4819046 (1989-04-01), Misy
patent: 4876584 (1989-10-01), Taylor
patent: 4881106 (1989-11-01), Barron
patent: 4896243 (1990-01-01), Chattorjoo

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