Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1995-12-05
1999-06-29
Hartary, Joseph
Etching a substrate: processes
Forming or treating thermal ink jet article
347 65, 156155, 264261, 264254, B41J 205, B44C 122
Patent
active
059164522
ABSTRACT:
A process for producing an ink jet head having ink discharging outlets, a substrate with energy generating elements that discharge ink, ink pathways aligned with the energy generating elements and communicated with the ink discharging outlets, and a liquid chamber for storing and supplying ink into the ink pathways. The process involves providing first and second substrates, forming on the first substrate a first solid layer having a pattern for forming ink pathways while using a surface of the first substrate as bottom walls for the ink pathways, forming on the first solid layer a second solid layer with a pattern for the liquid chamber, laminating the second substrate on the first substrate such that the opening of the second substrate is sealed by the second solid layer, to obtain a stacked body with space for forming circumferential walls for the ink pathways and liquid chamber, filling the space with hardening material, hardening the hardening material, and dissolving the first and second solid layers of the stacked body to remove the first and second solid layers, thereby forming the liquid chamber and ink supplying pathways.
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Hirosawa Toshiaki
Kobayashi Jun'ichi
Shiba Shoji
Yamane Toru
Canon Kabushiki Kaisha
Hartary Joseph
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