Sequential chemical vapor deposition

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

117 93, C30B 2514

Patent

active

059163658

ABSTRACT:
The present invention provides for sequential chemical vapor deposition by employing a reactor operated at low pressure, a pump to remove excess reactants, and a line to introduce gas into the reactor through a valve. A first reactant forms a monolayer on the part to be coated, while the second reactant passes through a radical generator which partially decomposes or activates the second reactant into a gaseous radical before it impinges on the monolayer. This second reactant does not necessarily form a monolayer but is available to react with the monolayer. A pump removes the excess second reactant and reaction products completing the process cycle. The process cycle can be repeated to grow the desired thickness of film.

REFERENCES:
patent: 4058430 (1977-11-01), Suntola et al.
patent: 4389973 (1983-06-01), Suntola et al.
patent: 4767494 (1988-08-01), Kobayashi
patent: 4845049 (1989-07-01), Sunakawa
patent: 4859627 (1989-08-01), Sunakawa
patent: 4876218 (1989-10-01), Pessa et al.
patent: 4993357 (1991-02-01), Scholz
patent: 5060595 (1991-10-01), Ziv et al.
patent: 5071670 (1991-12-01), Kelly
patent: 5130269 (1992-07-01), Kitahara et al.
patent: 5166092 (1992-11-01), Mochizuki et al.
patent: 5225366 (1993-07-01), Yoder
patent: 5256244 (1993-10-01), Ackerman
patent: 5270247 (1993-12-01), Sakuma et al.
patent: 5693139 (1997-12-01), Nishizawa et al.
Bedair,S.M., J. Vac. Sci. Technol., B 12(1), 179 (1994).
Higashi,G.S. and Fleming,C.G., Appl. Phys. Lett., 55(19), 1963 (1989).
Nishizawa,J. et al, J. Electrochem. Soc., 134, 945 (1987).
Nishizawa,J. et al, J. Electrochem. Soc., 132, 1197 (1985).
Nishizawa,J. et al, J. Vac. Sci. Technol., A 4(3), 706 (1986).
Hiltunin, L. et al, Thin Solid Films, 166, 149 (1988).
Hiltunin, L. et al, Materials Chemistry and Physics, 28, 379 (1991).
Leskela,M., Acta Polytechnica Scandinavica, Ch 195, 67 (1990).
Asikainen,T. et al, J. Electrochem. Soc., vol. , 1 (1994).
Kumagai,H. et al, Jpn. J. Appl. Phys. 33, 7086 (1994).
Sneh,O. et al, Surface Science 334, 135 (1995).
Ritala,M., et al, Thin Solid Films 250, 72 (1994).
Leskela,M. et al, J. Less Common Metals 153, 219 (1989).
Tammenmaa,M. et al, J. Crystal Growth 84, 151 (1987).
Leskela,M. et al, Mat. Res. Soc. Symp. Proc. 222, 315 (1991).
Leskela,M. et al, Chemtronics, 3, 113 (1988).
Ritala,M., et al, Thin Solid Films 225, 288 (1993).
Ritala, M., et al, Thin Solid Films 228, 32 (1993).
Ritala,M., et al, Chem. Mater. 5, 1174 (1993).
J.F.Fan, et al, Mat. Res. Soc Symp. Proc. 222, 327 (1991).
Atomic Layer Growth and Processing, Eds. T.F.Kuech, P.D.Dapkus, and Y.Aoyagi, Mat. Res. Soc. Proc. 222, 1991.
Atomic Layer Epitaxy, Eds. T.Suntola and M.Simpson, Chapman and Hall, NY 1990.
Sherman,A. Chemical Vapor Deposition for Microelectronics, Noyes Publications, New Jersey, 1987.
Proceedings of the Second International Atomic Layer Epitaxy Symposium, Thin Solid Films, vol. 225(1-2), (1993).
Proceedings of the Third International Atomic Layer Epitaxy Symposium, Applied Surface Science, vol. 82/83, (1994).
Sherman, A., "Chemical Vapor Depostion for Microelectronics," Noyes Publication, New Jersey, 1987.
Kumagai, H., Toyoda, K., Matsumoto, M., Ohara, M., "Comparative Study of Al.sub.2 O.sub.3 Optical Crystalline Thin Films Grown by Vapor Combinations of Al(CH.sub.3).sub.3 /N.sub.2 O and Al(CH.sub.3).sub.3 /H.sub.2 O.sub.2 ", Jpn. Appl. Phys. vol. 32, 6137, 1993.
Leskela, M., "Atomic Layer Epitaxy in the Growth of Polycrystalline and Amorphous Films" Acta Polytechnica Scandinvica, Chapter 195, 1990.
Bedair, S.M. Atomic Layer Epitaxy Deposition Process, J. Vac. Sci Technol. B 12(1), 179, 1994.
Ehrlich, D.J., Melngailis, J., "Fast Room-Temperature Growth of SiO.sub.2 Films by Molecular-layer Dosing", Appl. Phys. LeH. 58 2675, 1991.
Fan, J.F., Sugioka, K., Toyoda, K., "Low-Temperature Growth of Thin Films of Al.sub.2 D.sub.3 with Trimethylaluminum and Hydrogen Peroxide", Mat. Res. Soc. Symp. Proc. 222, 327, 1991.
Nakano, M., Sakaue, H., Kawamoto, A., Nagata, A., Hirose, M., "Digital Chemical Vapor Deposition of SiO.sub.2 ", Appl. Phys. Lett. 57, 1096, 1990.
Hiramatsu, K., Ohnichi, H., Takahama, T., Yamanshi, K. "Formation of TiN Films with Low Cl Concentration by Pulsed Plasma Chemical Vapor Deposition", J. Vac. Sci Techn. A14(3), 1037, 1996.
Levy, R.A., Green, M.L., "Low Pressure Chemical Vapor Deposition of Tungsten and Aluminum for VLSI Applications," J. Electrochem Soc, vol. 134, 37C, 1987.
Kondon, E., Kawano, Y., Takeyasu, N., Ohta, T. "Interconnection Formation by Doping Chemical-Vapor-Depostion Aluminum with Copper Simultaneously:Al-Cu CVD," J. Electro Chem. Soc. vol. 141, 3494, 1994.
Jensen, K.F., Cullen, G.W. "Proceedings of the Twelfth International Symposium on Chemical Vapor Deposition 1993," Proceedings vol. 93-2, The Electrochemical Society, Pennington, N.J., 1993.
"Corrosion of Aluminum and Aluminum Alloys," vol. 13 of Metals Handbook, ASM, Metals Park, OH, 1989.
Sherman, A. "In situ Removal of Native Oxide from Silicon Wafers," J. Vac. Sci. Technol. vol. B8(4) 656 (Jul./Aug. 1990).
Bermudez, V.M., "Simple, Efficient Technique for Exposing Surfaces to Hydrogen Atoms," J. Vac. Sci. Technol. vol A14,2671, 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sequential chemical vapor deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sequential chemical vapor deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sequential chemical vapor deposition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1372570

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.