Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1986-07-25
1989-02-28
Eley, Timothy V.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
29827, 174 524, H01L 2348
Patent
active
048090549
ABSTRACT:
A semiconductor lead frame suitable for making electronic components from semiconductor chips. The lead frame is of one-piece construction and is provided with a pair of spaced outer side strips and a plurality of spaced cross strips integral with and spanning the distance between the side strips. A plurality of pairs of pads are on the lead frame, there being a pair of spaced pads between each pair of adjacent cross strips. One of the pads of each pair is coupled to the outer ends of a pair of spaced, parallel legs which extend along the adjacent cross strips. The legs are bendable intermediate their ends sufficiently to cause the legs to become doubled upon themselves so that the pad coupled to the leg can be moved from an initial position generally spaced longitudinally from the corresponding other pad to a final position in overlying, spaced relationship to the other pad. A coating of solder applied to each pad, respectively, permits a semiconductor chip between the pads to be bonded to the pads when the lead frame is directed through a heating zone.
REFERENCES:
patent: 3893158 (1975-07-01), Linda
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4252864 (1981-02-01), Coldren
patent: 4322628 (1982-03-01), Tanaka
patent: 4446375 (1984-05-01), Aird
patent: 4633582 (1987-01-01), Ching et al.
LandOfFree
Semiconductor lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor lead frame will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1372191