Method for fabricating a transfer model optical semiconductor ap

Plastic and nonmetallic article shaping or treating: processes – Optical article shaping or treating – Composite or multiple layer

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Details

26427215, 26427217, 264275, 2643284, B29C 4502, B29C 4514

Patent

active

054726468

ABSTRACT:
A transfer molded semiconductor method arranges a semiconductor chip on a flat die pad so that, at least one predetermined edge surface of the semiconductor chip extends or protrudes over a corresponding edge of the flat die pad. The predetermined edge of the die pad is arranged on the opposite side of a gate beneath a lead frame at the other side. The arrangement suppresses the formation of voids at a side surface of the semiconductor chip, e.g., the side surface opposite the gate at which resin is injected.

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