Regeneration of spent electroless copper plating solution

Details Regeneration of spent electroless copper plating solution Regeneration of spent electroless copper plating solution

1994-11-30

1995-12-05

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204DIG13, 427 98, B01D 6144

Patent

active

054725852

ABSTRACT:
Disclosed is a method for removal of contaminants and replenishment of an electroless copper plating solution in order to allow reuse of the solution. Copper oxide is dissolved in the spent solution and this is followed by an electrodialysis which removes formate and carbonate ions.

REFERENCES:
patent: 4199623 (1980-04-01), Nuzzi et al.
patent: 4324629 (1982-04-01), Oka et al.
patent: 4805553 (1989-02-01), Krulik
patent: 5091070 (1992-02-01), Bauer et al.
"Selemion Ion-Exchange Membranes," product literature of Asahi Glass Co., Ltd. (1992), pp. 3-18.

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