Polyhydric phenol from naphthaldehyde and epoxy resin obtained u

Details Polyhydric phenol from naphthaldehyde and epoxy resin obtained u Polyhydric phenol from naphthaldehyde and epoxy resin obtained u

1994-08-08

1995-12-26

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523457, 523458, 523459, 523466, 525481, 525482, 525484, 525486, 528 97, 427386, 264572, C08L 6300

Patent

active

054788714

ABSTRACT:
The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

REFERENCES:
patent: 4960634 (1990-10-01), Boyko et al.

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