Method for mounting an integrated circuit device onto a printed

Details Method for mounting an integrated circuit device onto a printed Method for mounting an integrated circuit device onto a printed

1995-08-17

1999-06-29

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29741, 29744, 29840, 228 62, 22818021, 228212, 324754, H05K 334, B23K 3102, B23P 1900, G01R 3100

Patent

active

059157496

ABSTRACT:
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

REFERENCES:
patent: 3612955 (1971-10-01), Butherus et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 4620663 (1986-11-01), Odashima et al.

Affiliated with

Also associated with

Rating

Method for mounting an integrated circuit device onto a printed does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting an integrated circuit device onto a printed , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting an integrated circuit device onto a printed will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1369139