Method of manufacturing semiconductor device with retrograde wel

Fishing – trapping – and vermin destroying

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437 70, 437154, 437931, H01L 21266

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054787599

ABSTRACT:
A thick isolation oxide film is selectively formed on a surface of a silicon substrate so as to isolate an element formation region. Ions are implanted into a region in silicon substrate through the thick isolation oxide film. Thus, retrograde wells, having impurity concentration peak positions are formed in the region of silicon substrate positioned under the isolation oxide film. Then, an upper part of the isolation oxide film is removed away to form an isolation oxide film with a reduced thickness. Isolation oxide film has a reduced isolation length L. Thus, a semiconductor device is provided, which permits restriction of the narrow channel effect and the substrate biasing effect when the size of elements is reduced.

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John Yuan-Tai Chen: Quadruple-Well CMOS for VLSI Technology; US period.: IEEE Transactions on Electron Devices, vol. ED-31, No. 7, Jul. 1984, pp. 910 to 919.
Odanaka, S., Yabu, T., Shimizu, N. et al.: A Self-Aligned Retrograde Twin-Well Structure with Buried p.sup.+ -Layer, US period.: IEEE Electron Device Letters, vol. 10, No. 6, Jun. 1989, pp. 280 to 282.
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