Suction lipolysis

Details Suction lipolysis Suction lipolysis

1997-04-22

1999-04-06

Bockelman, Mark

Surgery

Means for introducing or removing material from body for...

Material introduced into and removed from body through...

604 56, 604113, 435267, A61M 100

Patent

active

058910832

ABSTRACT:
A compound, solution of carrier and the compound and a medical procedure is provided for suction lipolysis. The compound is preferably either one or more enzymes and/or emulsifying agents and/or detergents which digest or dissolve fat in the subcutaneous tissues. Both enzymes which degrade fats and emulsifying agents can be used according to the invention. The carrier is preferably a saline solution. A suction lipolysis procedure is provided including the steps of providing a biological and/or chemical compound which digests or dissolves fat in the subcutaneous tissues. The compound is dissolved into a saline solution and/or is suspended in a saline solution. The combination compound and saline solution is then heated to the body temperature (temperature of the patient or subject). The compound and saline solution including the compound is then injected into the subcutaneous tissue. Liposuction is then performed (suction lipectomy). The step of performing liposuction is preferably initiated after a period of time has elapsed after the saline solution and compound are infiltrated into the subcutaneous tissue.

REFERENCES:
patent: 3634191 (1972-01-01), Laboureur
patent: 4968621 (1990-11-01), Pfleiderer et al.
patent: 5089414 (1992-02-01), Christner et al.
patent: 5143063 (1992-09-01), Fellner
patent: 5422261 (1995-06-01), Lee et al.
patent: 5424208 (1995-06-01), Lee et al.

Affiliated with

Also associated with

Rating

Suction lipolysis does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Suction lipolysis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Suction lipolysis will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1366624