Metallized substrates and process for producing

Details Metallized substrates and process for producing Metallized substrates and process for producing

1986-09-10

1989-02-28

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 384, C25D 502

Patent

active

048082740

ABSTRACT:
The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate on which is formed a pattern such as a conductor line pattern, the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers from a metallo organic composition which is built up with a metal conductor.

REFERENCES:
patent: 4303480 (1981-12-01), Wood

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