Semiconductor device with thin film resistor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257540, 257537, H01L 2302, H01L 2702

Patent

active

054752540

ABSTRACT:
On a semiconductor substrate, a thin film resistor and a metal wiring for electrically extracting the thin film resistor are formed via a firth interlayer insulator. A second interlayer insulator covering the thin film resistor and the metal wiring is formed on the first insulation layer. By removing the portion of the second interlayer insulator above the thin film resistor by etching, the insulator above the thin film resistor is provided thinner thickness. A heat radiating metal layer is formed on the second interlayer insulator having the thinner thickness.

REFERENCES:
patent: 3862017 (1975-01-01), Tsunemitsu et al.
patent: 4091408 (1978-05-01), Lee et al.
"A High-Power GaAs FET Having Buried Plated Heat Sink for High-Performance MMIC's" vol. 41 No. 1 Jan. 1994, Ishikawa et al.

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