High dielectric multilayer capacitor

Details High dielectric multilayer capacitor High dielectric multilayer capacitor

1988-12-29

1989-08-01

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361330, H01G 410, H01G 438

Patent

active

048538272

ABSTRACT:
A multilayer capacitor is presented which provides high capacitance and low inductance. The capacitor comprises a plurality of conductive layers, each separated from the other and sandwiching therebetween a high capacitance flexible dielectric sheet material. The dielectric sheet material is comprised of a monolayer of multilayer or single layer high dielectric (e.g. ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric (e.g. ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces.

REFERENCES:
patent: 3582729 (1971-06-01), Girard et al.
patent: 3673092 (1972-06-01), Dietz
patent: 3720862 (1973-03-01), Mason
patent: 3988405 (1976-10-01), Smith et al.
patent: 4071881 (1978-01-01), Bacher
patent: 4752857 (1988-06-01), Khoury et al.

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