Method and equipment to solder printed-circuit assemblies

Details Method and equipment to solder printed-circuit assemblies Method and equipment to solder printed-circuit assemblies

1988-01-27

1989-02-28

Godici, Nicholas P.

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281801, 228260, 228 7, 228 10, 228 37, 228 43, 269 46, 269111, 269903, H05K 334, B23K 3704

Patent

active

048077941

ABSTRACT:
To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).

REFERENCES:
patent: 4363434 (1982-12-01), Flury

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