Process of mounting tape automated bonded semiconductor chip on

Details Process of mounting tape automated bonded semiconductor chip on Process of mounting tape automated bonded semiconductor chip on

1995-04-28

1995-12-12

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437215, 437217, 437219, H01L 2160

Patent

active

054749573

ABSTRACT:
Conductive leads are connected at inner ends thereof to electrodes of a semiconductor chip through a tape automated bonding process, and bumps are formed on the other ends of the conductive leads so as to economically and reliably mount the semiconductor chip on a circuit board through a concurrent reflow.

REFERENCES:
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patent: 5240588 (1993-08-01), Ucaida
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5262351 (1993-11-01), Bureau et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5362656 (1994-11-01), McMahon
patent: 5376588 (1994-12-01), Penose
patent: 5409865 (1995-04-01), Karnezos

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