Method and apparatus for high-flatness etching of wafer

Details Method and apparatus for high-flatness etching of wafer Method and apparatus for high-flatness etching of wafer

1994-07-21

1995-12-12

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1566391, 216 88, 216 91, B05C 500

Patent

active

054746442

ABSTRACT:
A method and an apparatus for high-flatness etching a semiconductor single crystal wafer wherein said wafer is so rotated in a flow of an ethchant radially spreading in a plane that the main surface of said wafer may move parallelly with the flow of said etchant.

REFERENCES:
patent: 5019205 (1991-05-01), Endl et al.
IBM Technical Disclosure Bulletin, V.6,N.4 pp. 5-6; Electropolishing Semiconductor Wafers, Sep. 1963.

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