Contacting method and structure for integrated circuit pads

Details Contacting method and structure for integrated circuit pads Contacting method and structure for integrated circuit pads

1988-07-15

1990-04-03

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 437194, H01L 2144

Patent

active

049140574

ABSTRACT:
The instant invention relates to a process for forming protruding contacts on an integrated circuit aluminum pad, comprising the following steps: providing beneath the aluminum pad (21) a conductive polycrystalline silicone layer (23); locally removing the aluminum layer for uncovering a portion of the surface of the polycrystalline silicon layer; establishing a connection with the polycrystalline silicon layer by means of a drop of conductive adhesive (30).

REFERENCES:
patent: 3667008 (1972-05-01), Katnack
patent: 3806361 (1974-04-01), Lehner
patent: 4442966 (1984-04-01), Jourdian et al.
patent: 4666737 (1987-05-01), Gimpelson et al.
Patent Abstracts of Japan, vol. 9, No. 250 (E-353) [1993], Oct. 26, 1985.

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