Thin substrate micro-via interconnect

Details Thin substrate micro-via interconnect Thin substrate micro-via interconnect

1994-05-10

1996-02-20

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

427554, B23K 2600

Patent

active

054930960

ABSTRACT:
A method for forming conductive via interconnects utilizes the steps of: applying a sacrificial coating to at least one surface of a substrate; laser drilling the substrate through the sacrificial coating to form a via through-hole; applying a conductive coating to the via through-hole; and removing the sacrificial coating(s). Recasting and shattering thus occur in the sacrificial coating rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.

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