Apparatus for control of contamination in spin systems

Coating apparatus – With means to centrifuge work

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Details

118 56, 118319, 118320, 118500, B05C 1102, B05C 1300, B05C 1302, B05C 500

Patent

active

057256632

ABSTRACT:
A substrate wafer processing method and apparatus is disclosed utilizing a bowl having a central axis, a baffle surface positioned above the inside bottom surface of the bowl and a chuck member having a top surface for supporting and spinning substrate and positionable coaxially within the bowl closely spaced from the baffle surface. Means and methods are described for directing a gas stream radially outwardly between the bottom surface of the chuck member and the baffle. The specific surface construction of the baffle is disclosed as part of a plenum member as well as a deflecting surface that projects to a level above the top surface of the substrate.

REFERENCES:
patent: 3870014 (1975-03-01), Buck
patent: 4790262 (1988-12-01), Nakayama et al.
patent: 5472502 (1995-12-01), Batchelder
patent: 5492566 (1996-02-01), Sumnitsch
patent: 5529626 (1996-06-01), Stewart

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