Method of dry etching platinum using sulfur containing gas

Fishing – trapping – and vermin destroying

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437245, 437919, 437192, 1566461, 216 6, 216 75, H01L 213065

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active

054928559

ABSTRACT:
A method of manufacturing a semiconductor device, where on top of a substrate having already-completed circuit elements and wiring, etc., an insulation underlayer a, Pt layer for a bottom electrode, a dielectric film and a Pt layer for a top electrode are shaped. A top electrode, capacitance insulation film and bottom electrode are formed by etching the Pt layer for the top electrode or the Pt layer for the bottom electrode using an etching gas contained a S component while composing a Pt and S compound. Alternatively the Pt and S compound can be composed first, and then the compound can be etched.

REFERENCES:
patent: 5227337 (1993-07-01), Kadomura
patent: 5381302 (1995-01-01), Sandhu et al.
patent: 5424238 (1995-06-01), Sameshima
Van Glabbeek et al., "Reactive Ion Etching of Pt/PbZrTiO.sub.3 /Pt Integrated Ferroelectric Capacitors", Materials Research Society Symposium Proceedings, (1993), vol. 310, pp. 127-132.
Extended Abstracts, Autumn Meeting 1991, The Japan Society of Applied Physics, 9p-ZF-17, p. 517.
Extended Abstracts, Spring Meeting 1993, The Japan Society of Applied Physics, 30a-ZE-3, p. 577.

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