Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1988-05-23
1990-04-03
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156289, 1563309, 1563311, 4284735, 4284796, 524104, 524173, 524233, 525432, 528353, B32B 3100
Patent
active
049137590
ABSTRACT:
A polyimide precursor suitable for use in the pseudo hot-melt prepregging process is described. It consists essentially of a mixture of (a) about 40 to about 70 percent by weight of a substantially equimolar mixture of (i) 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane or 2,2-bis[4-(3-aminophenoxy)phenyl]hexafluoropropane, or both, and (ii) lower alkyl diester of aromatic tetracarboxylic acid; (b) about 2 to about 50 percent by weight of polyamide (polyamic acid or ester) producible from components (i) and (ii); and (c) about 10 to about 50 percent by weight of solvent with the proviso that the mixture is a clear resinous solid at 25.degree. C. and is a viscous, tacky, varnish-like liquid at a temperature falling in the range of 40.degree. C. to 100.degree. C. Also described are use of the polyimide precursors in preparing coated paper webs useful in preparing paper-backed prepregging tape, and use of the coated paper webs in preparing the paper-backed prepregging tapes.
REFERENCES:
patent: 3511807 (1970-05-01), Lovejoy
patent: 3554939 (1971-01-01), Lavin et al.
patent: 3654227 (1972-04-01), Sine-Hart
patent: 4111906 (1978-09-01), Jones et al.
patent: 4124651 (1978-11-01), Lohmann et al.
patent: 4305796 (1981-12-01), Gagliani et al.
patent: 4336175 (1982-06-01), Gibby
patent: 4535101 (1985-08-01), Lee et al.
patent: 4690999 (1987-09-01), Numata et al.
Ethyl Corporation
Gallagher John J.
Hammond Richard J.
Sieberth John F.
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