Semiconductor device

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357 73, H01L 2328, H01L 2330

Patent

active

048537616

ABSTRACT:
A semiconductor device obtained by using plastic molding to obtain an ultraviolet ray erasable type EPROM semiconductor chip in which an ultraviolet ray transparent resin film is inserted between the semiconductor chip and the molding material so as to cover a portion of the surface or the whole surface of the semiconductor chip except for the surfaces of the wire bonding electrodes.

REFERENCES:
patent: 4001872 (1977-01-01), Khajezadeh
patent: 4574465 (1986-03-01), Rao
patent: 4630095 (1986-12-01), Otsuka et al.

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