Multi-layer ceramic wiring circuit board and process for produci

Details Multi-layer ceramic wiring circuit board and process for produci Multi-layer ceramic wiring circuit board and process for produci

1984-12-21

1986-10-28

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 428209, H05K 103

Patent

active

046202641

ABSTRACT:
A multi-layer ceramic wiring board consisting of alternately laminated ceramic insulating substrates and wiring conductor layers in which the inner-layer ceramic insulating substrates contacting the inside layers of signal wiring conductor are made of a ceramic insulator having a relative dielectric constant of 6.0 or below and a relatively low density and the ceramic insulating substrates of other layers are made of a ceramic insulator having a tensile strength of 4 kgf/mm.sup.2 or above and a relatively high density. In preparation of the board, each of the inner-layer ceramic insulating substrates is preferably formed from a green sheet obtained by drying a thin layer of a slurry containing 70 to 90 parts of ceramic filler particles having a particle size of 5 .mu.m or greater and 30 to 10 parts of glass powder while each of other ceramic insulating substrates is preferably formed from a green sheet obtained by drying a thin layer of a slurry containing 70 to 90 parts of ceramic filler particles having a particle size of less than 5 .mu.m and 30 to 10 parts of glass powder.

REFERENCES:
patent: 2859794 (1958-11-01), Barr
patent: 3772748 (1973-11-01), Rutt, II
patent: 3829356 (1974-08-01), Rutt
patent: 4141055 (1979-02-01), Berry et al.
patent: 4237006 (1980-12-01), Niwa et al.
patent: 4382236 (1983-05-01), Suzuki
patent: 4387131 (1983-06-01), Anderson et al.
Anderson et al., Low-Dielectric Glass Substrate, IBM Tech. Disc. Bull., vol. 14 #9, Feb. 1972, p. 2581, relied on.
C. M. McIntosh, Multilayer Ceramic Sandwiches, IBM Tech. Disc. Bull., vol. 16 #1, Jun. 1973, p. 43, relied on.

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