Unitary slotted heat sink for semiconductor packages

Details Unitary slotted heat sink for semiconductor packages Unitary slotted heat sink for semiconductor packages

1985-12-23

1986-10-28

James, Andrew J.

357 82, 357 68, 357 65, H01L 2334, H01L 2346, H01L 2312

Patent

active

046202161

ABSTRACT:
A unitary heat sink for a semiconductor package having a plurality of cooling fin elements, each element having upwardly extending openings that divide the base into a plurality of leg portions, the heat sink having a plurality of flat base portions individually bonded to a surface of the package, each of the leg portions of an individual fin element being integral with different but adjacent flat base portions, in operation the heat sink preventing a build-up of stresses at the bonded interface of the base portions and package due to differential coefficient of expansions of the heat sink and package.

REFERENCES:
patent: 4296456 (1981-10-01), Leaycraft et al.
"Heatsink Design for Cooling Modules in Forced Air Environment"--Arnold et al--IBM Technical Disclosure Bulletin--vol. 22, No. 6, Nov. 1979, pp. 2297-2298.
"Cooling Fin Structure"--Horvath--IBM Technical Disclosure Bulletin--vol. 23, No. 2, Jul. 1980, pp. 603-604.

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