Method of making semiconductor devices having an implant damage

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 44, 437 61, H01L 21266

Patent

active

051457970

ABSTRACT:
In a MOS transistor or memory cell that uses a thin oxide film as a gate insulation film, ion-implantation-induced damage protection films (mask oxide films) are formed on side walls of a polysilicon gate electrode to minimize flaws in the structure of the thin oxide film right under the polysilicon gate electrode edge, which are induced by the ion implantation performed during the process of forming self-aligned source and drain regions.

REFERENCES:
patent: 4804637 (1989-02-01), Smayling et al.
patent: 4852062 (1989-07-01), Baker et al.
patent: 4868137 (1989-09-01), Kubota

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making semiconductor devices having an implant damage does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making semiconductor devices having an implant damage , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making semiconductor devices having an implant damage will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-133925

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.