Stackable microelectronic components with self-addressing scheme

Details Stackable microelectronic components with self-addressing scheme Stackable microelectronic components with self-addressing scheme

1997-07-30

1999-11-16

Kamm, William E.

Surgery: light, thermal, and electrical application

Light, thermal, and electrical application

Electrical therapeutic systems

A61N 1375

Patent

active

059873574

ABSTRACT:
A memory device particularly useful in size-constrained electronic products, such as cardiac stimulators. To provide additional memory for such size-constrained products, memory chips are stacked one on top of another. The memory chips are configured to facilitate bonding without crossed contacts, using aligned bonding pads, vias, or castellations. Each memory chip also includes an address selection circuit that receives signals from one or more address lines to selectively enable and disable the memory chips in the stack.

REFERENCES:
patent: 4614194 (1986-09-01), Jones et al.
patent: 4616655 (1986-10-01), Weinberg et al.
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5373189 (1994-12-01), Massit et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5674260 (1997-10-01), Weinberg
patent: 5734559 (1998-03-01), Banerjee et al.
Tuckerman et al, "Laminated Memory: A new 3-D packaging Technology for MCMs", IEEE, pp. 58-63, Jul. 1994.
Dense-Pac Microsystems data sheets "8 Megabit High Speed Cmos SRAM", pp. 1-8, (no date, but received/submitted as prior art on Feb. 20, 1996.

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