Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Patent
1998-12-21
2000-07-25
Zarabian, Amir
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
438158, 438166, H01L 2100
Patent
active
060935782
ABSTRACT:
The invention concerns a collective manufacturing method for a plurality of individual electro-optical cells each formed of two outer substrates and one intermediate substrate inserted between the outer substrates. The substrates are connected to each other by a sealing frame to form two cavities receiving liquid crystals. This method includes a step consisting in making a zone of least mechanical resistance along the contour of each individual double cell in the intermediate plate in order to facilitate the division of the batch into individual cells during the step of dividing the batch by scribing and breaking the outer substrates.
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Patent Abstracts of Japan, JP 58 106523, Jun. 24, 1983, vol. 007, No. 212.
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Patent Abstracts of Japan, JP 58 181022, Oct. 22, 1983, vol. 8, No. 23.
Klappert Rolf
Kunzi Jean-Michel
Asulab S.A.
Lebentritt Michael S.
Zarabian Amir
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