Process for producing a ceramic-metal substrate

Details Process for producing a ceramic-metal substrate Process for producing a ceramic-metal substrate

1998-11-12

2000-07-25

Gorgos, Kathryn

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

205125, 205126, 204224, 204228, 204920, B05D 512

Patent

active

060934433

ABSTRACT:
The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating, on one surface side is provided with a first metal coating and on the opposite surface side with a second metal coating which extends into at least one opening and is connected to the first metal coating, for formation of the first metal coating a copper foil being applied by DCB technique to one surface side of the ceramic layer.

REFERENCES:
patent: 3350498 (1967-10-01), Leeds
patent: 3475284 (1969-10-01), Olson
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4964923 (1990-10-01), Takeuchi et al.

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