Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1998-11-12
2000-07-25
Gorgos, Kathryn
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
205125, 205126, 204224, 204228, 204920, B05D 512
Patent
active
060934433
ABSTRACT:
The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating, on one surface side is provided with a first metal coating and on the opposite surface side with a second metal coating which extends into at least one opening and is connected to the first metal coating, for formation of the first metal coating a copper foil being applied by DCB technique to one surface side of the ceramic layer.
REFERENCES:
patent: 3350498 (1967-10-01), Leeds
patent: 3475284 (1969-10-01), Olson
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4964923 (1990-10-01), Takeuchi et al.
Exel Karl
Schulz-Harder Jurgen
Curamik Electronics GmbH
Gorgos Kathryn
Keehan Christopher M.
LandOfFree
Process for producing a ceramic-metal substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for producing a ceramic-metal substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing a ceramic-metal substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1334935