Heat sink and information processor using it

Details Heat sink and information processor using it Heat sink and information processor using it

1997-12-31

2000-03-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361687, 361690, 361710, 361722, 174 152, 174 163, 174252, 165 802, 165 803, 165185, H05K 720

Patent

active

060439807

ABSTRACT:
The present invention relates to a heat sink. It is an object of the present invention to provide a heat sink at a low manufacturing cost, the life of the motor of which is long so that the reliability of the heat sink can be enhanced and, further, a sufficiently high cooling performance can be obtained and the designing of the heat sink can be easily performed. The heat sink includes: a bottom surface coming into contact with a heating element; a side on which a plurality of ventilation holes are formed; and an upper surface into which a cooling fan composed of blades and a motor is embedded and fixed.

REFERENCES:
patent: 5272599 (1993-12-01), Koenen
patent: 5377745 (1995-01-01), Hsieh
patent: 5526875 (1996-06-01), Lin
patent: 5583316 (1996-12-01), Kitahara et al.
patent: 5594623 (1997-01-01), Schwegler
Abstract of Japanese Publication No. 8-017979.
Abstract of Japanese Publication No. 8-321571.
Abstract of Japanese Publication No. 5-304379.

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