Method of making an integrated circuit with oxidizable trench li

Semiconductor device manufacturing: process – Making passive device – Trench capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438431, 438432, 438692, H01L 2176, H01L 2162

Patent

active

059267178

ABSTRACT:
A method for isolating a first active region from a second active region, both of which are configured within a semiconductor substrate. The method comprises forming a trench in the semiconductor substrate between said first active region and said second active region. A first dielectric layer is then formed on said trench and a polysilicon layer is deposited on said first dielectric layer. The polysilicon layer is then thermally oxidized to form a second dielectric layer. Preferably the first dielectric is a thermal oxide 40 to 500 angstroms in thickness consuming less than 200 angstroms of said first active region and said second active region. The polysilicon layer is preferably between 1000 to 2000 angstroms.

REFERENCES:
patent: 4356211 (1982-10-01), Riseman
patent: 4471525 (1984-09-01), Sasaki
patent: 4493740 (1985-01-01), Komeda
patent: 4621414 (1986-11-01), Iranmanesh
patent: 4666556 (1987-05-01), Fulton et al.
patent: 4921816 (1990-05-01), Ino
patent: 4978634 (1990-12-01), Shen et al.
patent: 5075248 (1991-12-01), Yoon et al.
patent: 5234856 (1993-08-01), Gonzalez
patent: 5246537 (1993-09-01), Cooper et al.
patent: 5248625 (1993-09-01), Pasch
patent: 5250458 (1993-10-01), Tsukamoto et al.
patent: 5258321 (1993-11-01), Shimizu et al.
patent: 5346845 (1994-09-01), Jun
patent: 5472904 (1995-12-01), Figura et al.
patent: 5504027 (1996-04-01), Jeong et al.
patent: 5521111 (1996-05-01), Sato
patent: 5571743 (1996-11-01), Henkels et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making an integrated circuit with oxidizable trench li does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making an integrated circuit with oxidizable trench li, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an integrated circuit with oxidizable trench li will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1331053

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.