Method for encapsulating an integrated circuit using a removable

Details Method for encapsulating an integrated circuit using a removable Method for encapsulating an integrated circuit using a removable

1992-09-22

1994-09-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437902, 26427215, 26427217, 264278, H01L 2156, H01L 2158, H01L 2160

Patent

active

053447956

ABSTRACT:
A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.

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