Flexible interface structures for electronic devices

Metal working – Method of mechanical manufacture – Electrical device making

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439 66, 439 67, 174254, 428209, 428901, 427455, 427456, 427 96, 427 97, 427 99, 427123, 427124, 427125, 427191, 427192, 427404, 264139, 264145, 264154, 264155, 264156, 216 13, 216 17, 216 56, 216 65, 216 72, 29832, H01R 4300, H01L 2340, H01L 23498

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06092280&

ABSTRACT:
A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least one via extending therethrough to the surface metallization; and a floating pad structure including floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

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patent: 5473119 (1995-12-01), Rosenmayer et al.
patent: 5502002 (1996-03-01), Wong et al.

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