Method for encapsulating semiconductor devices with package bodi

Details Method for encapsulating semiconductor devices with package bodi Method for encapsulating semiconductor devices with package bodi

1992-08-21

1994-09-06

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

With step of making mold or mold shaping, per se

26427217, 2642972, 425190, 249155, B29C 4510, B29C 4514

Patent

active

053446003

ABSTRACT:
A method of encapsulating a semiconductor device permits use of the same mold for various package types. In one form, a mold (34 and 36) has a first cavity (50) in which a first insert (52 and 53) is positioned, the first insert defining a length and a width of a package body which is to be formed in the mold. The first insert in the first cavity also defines a second cavity (54) in which a second insert (56 and 57) is positioned, the second insert defining a thickness of the package body. Plastic is inserted into the mold to form the package body. To form other package types, one or more inserts are replaced instead of using a different mold. In another embodiment, the inserts are adjustable. For example, rather than having to change inserts to form a package with a different thickness, the inserts are adjusted by, for instance, a screw mechanism (66) within the mold or by the addition or removal of shims (60).

REFERENCES:
patent: 4158910 (1979-06-01), Hanas et al.
patent: 4330248 (1982-05-01), Platte
patent: 4618466 (1986-10-01), McGlashen
patent: 4711688 (1987-12-01), Pienimaa
patent: 4837184 (1989-06-01), Lin et al.
patent: 4915607 (1990-04-01), Medders et al.
patent: 5049526 (1991-09-01), McShane et al.
patent: 5116450 (1992-05-01), Spoo et al.
patent: 5125826 (1992-06-01), Vac
patent: 5149479 (1992-09-01), Nakajima

Affiliated with

Also associated with

Rating

Method for encapsulating semiconductor devices with package bodi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for encapsulating semiconductor devices with package bodi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encapsulating semiconductor devices with package bodi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1328003