Heat pipe lid for electronic packages

Details Heat pipe lid for electronic packages Heat pipe lid for electronic packages

1997-05-05

1999-03-09

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257714, 257708, 257710, 257713, 257717, 257722, H01L 23347, H01L 2504, H01L 2346, H01L 2342

Patent

active

058805249

ABSTRACT:
An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the package substrate creating a space therebetween for accommodating the semiconductor device. The package cover includes an external top surface and an external bottom surface and an inner cavity that comprises a heat pipe. The semiconductor device is thermally coupled to the bottom external surface of the cover.

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