Method of making polymeric semiconductor body

Details Method of making polymeric semiconductor body Method of making polymeric semiconductor body

1998-05-22

1999-11-16

Fiorilla, Christopher A.

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

Conductive carbon containing

264175, C04B 3500, B29C 6720

Patent

active

059851945

ABSTRACT:
The method of making a semiconductor body from a semiconductor polymeric compound containing about 20% by weight lampblack having a porous structure, about 60% by weight of low density polyethylene, about 8.5% by weight ethylene vinyl acetate copolymer, about 4.0% by weight calcium stearate, about 3.0% by weight antioxidant and about 0.5% by weight calcium titanate includes the steps of extruding the semiconductor polymeric compound to form an extruded product and subsequently calendering the extruded product to produce a semiconductor body having an electrical conductivity which is as uniform as possible throughout the entire bulk of the semiconductor body.

REFERENCES:
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patent: 4465617 (1984-08-01), Whipple et al.
patent: 4849133 (1989-07-01), Yoshida et al.
patent: 5143649 (1992-09-01), Blackledge
patent: 5277729 (1994-01-01), Endo et al.

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