Semiconductor wafer carrier

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

451287, 451288, B24B 3700

Patent

active

059850949

ABSTRACT:
The carrier assembly includes an internal pressurized fluid circuit which places an incompressible fluid layer between a pressure plate and an internal diaphragm. The internal diaphragm has a flexible portion providing gimbal action for the carrier assembly. The diaphragm and hydrostatic forces of the internal fluid circuitry combine to form a gimbal action exhibiting low friction, but which is otherwise rigid in other axes.

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