1978-05-31
1980-04-01
Wojciechowicz, Edward J.
357 68, 357 81, 357 74, H01L 2348
Patent
active
041964420
ABSTRACT:
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.
REFERENCES:
patent: 3889286 (1975-06-01), De Besis
patent: 3969754 (1976-07-01), Kuniya et al.
Arakawa Hideo
Kuniya Keiichi
Maeda Kunihiro
Morita Keiichi
Hitachi , Ltd.
Wojciechowicz Edward J.
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