Semiconductor device

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357 68, 357 81, 357 74, H01L 2348

Patent

active

041964420

ABSTRACT:
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.

REFERENCES:
patent: 3889286 (1975-06-01), De Besis
patent: 3969754 (1976-07-01), Kuniya et al.

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