Semiconductor device and method for mounting semiconductor wafer

Details Semiconductor device and method for mounting semiconductor wafer Semiconductor device and method for mounting semiconductor wafer

1993-12-13

1995-06-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361711, 361752, 361796, 174 152, 174252, 257720, 257675, H05K 720

Patent

active

054249171

ABSTRACT:
A semiconductor device comprises a printed circuit board with circuit pattern formed thereon, and a semiconductor wafer having terminals installed on its peripheral portion. Semiconductor chips are mounted on one surface or both surfaces of the semiconductor wafer. A connector is installed on the printed circuit board for electrical connection with the terminals. When the terminals are connected to the circuit pattern, the semiconductor wafer is installed substantially vertically on the printed circuit board. Or a semiconductor wafer member is constituted by two semiconductor wafers, and a closed space is internally formed between the two wafers and heat pipes for heat radiation are inserted in the closed space.

REFERENCES:
patent: 4479088 (1984-10-01), Stopper
patent: 4697858 (1987-10-01), Balakrishnan
patent: 4734825 (1988-03-01), Peterson
patent: 4849858 (1989-07-01), Grapes
patent: 4872088 (1989-10-01), Hawkins
patent: 4971570 (1990-11-01), Tolle
patent: 5051865 (1991-09-01), Kato
patent: 5091822 (1992-02-01), Takashima
patent: 5119273 (1992-06-01), Corda
patent: 5191224 (1993-03-01), Tazunoki et al.
Yamada, et al., Nikkei Microdevices, "Neural Network Neurotip Wafer", Dec. 1989, pp. 99-105.

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