Combination conductive and convective heatsink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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165 804, 174 152, 361796, H05K 720

Patent

active

054249163

ABSTRACT:
A combination conductive and convective heatsink for use in an electronic module including a heatsink member having first and second major planar surfaces; each surface adapted for thermally engaging with an adjacent electronic circuit element. The heatsink member also includes a plurality of flow-through channels disposed between the first and second major planar surfaces. The flow-through channels engage with flow-through passages in an electronic module mounting rack, for allowing the flow of a fluid medium through the passages and the channels for convectively cooling the electronic module. The heatsink also includes a plurality of thermally conductive members disposed between the first and second major planar surfaces of the heatsink member, for thermally conductively engaging the heatsink member with the electronic module mounting rack for conducting heat from the electronic module to the mounting rack.

REFERENCES:
patent: 4442475 (1984-04-01), Franklin
patent: 4829402 (1989-05-01), Gewebler
patent: 4878158 (1989-10-01), Sauzade
patent: 4931905 (1990-06-01), Cirrito
patent: 4958257 (1990-09-01), Wenke
patent: 5077637 (1991-12-01), Martorana
patent: 5131456 (1992-07-01), Wu
patent: 5224017 (1993-06-01), Martin
patent: 5224030 (1993-06-01), Banks

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