Method of fabricating an electronic circuit device and apparatus

Details Method of fabricating an electronic circuit device and apparatus Method of fabricating an electronic circuit device and apparatus

1996-11-19

1999-03-09

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228207, 22818022, H01L 2160, B23K 100

Patent

active

058789430

ABSTRACT:
In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

REFERENCES:
patent: 4334646 (1982-06-01), Campbell
patent: 5526978 (1996-06-01), Nagatsuka et al.

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