Process for depositing a conducting metal layer on an insulating

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156155, 156237, 156239, 427 98, 427123, 427125, 427271, 427277, 427278, 427305, 427357, 427367, 427368, B32B 3126, B05D 310

Patent

active

041960297

ABSTRACT:
Process for depositing a thin conducting metal layer on an insulating support comprising the steps of applying on said support a layer of nonconducting ink loaded with a powder of metal, alloy or metallic derivative, heating said support and said layer to harden said ink layer, treating the surface of said layer so as to lay the particles forming said powder bare and immersing said thus coated support into a bath containing, in the form of particles, the conducting metal to be deposited, under conditions which are known per se and such that said conducting metal particles are deposited on the powder particles laid bare, wherein is used as insulating support a support made of an inorganic material provided with an enamel coating and the ink used being a compound formed of an enamel and a carrier, the melting point of said enamel being substantially equal to, and preferably slightly lower than, the softening point of the outer layer of said coating.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble
patent: 3399268 (1968-08-01), Schneble
patent: 3424658 (1969-01-01), Norton
patent: 3763004 (1973-10-01), Wainer
patent: 3772075 (1973-11-01), Tarnopol

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