Method and apparatus for testing an unpackaged semiconductor die

Details Method and apparatus for testing an unpackaged semiconductor die Method and apparatus for testing an unpackaged semiconductor die

1992-06-10

1995-06-13

Nguyen, Vinh

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 3128

Patent

active

054246520

ABSTRACT:
A method and apparatus for testing a singularized semiconductor die prior to packaging the die, thereby allowing for the packaging or other use of only known good die. The apparatus employs a housing of ceramic or other workable material. Contact pads on the interior of the package are coupled to exterior leads with conductive traces. The back side of a semiconductor die to be tested is removably mounted to a lid, and the bond pads on the die are aligned with the contact pads on the interior of the package. The lid is attached to the package thereby electrically coupling the contact pads with the bond pads on the die. Since the package has conventional exterior form and function the package is operational as a functioning device.

REFERENCES:
patent: 4340860 (1982-07-01), Teeple, Jr.
patent: 4554505 (1985-11-01), Zachry
patent: 4729166 (1988-03-01), Lee et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5302891 (1994-04-01), Wood et al.

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