Metal founding – Process – Shaping liquid metal against a forming surface
Patent
1998-04-09
1999-11-16
Ryan, Patrick
Metal founding
Process
Shaping liquid metal against a forming surface
257704, B22D 1914, H01L 2312
Patent
active
059839740
ABSTRACT:
A lid for a chip/package system includes a body sized to fit over an integrated circuit chip and being connectable to a package. The body has at least two regions exhibiting different coefficients of thermal expansion, with one CTE matching that of the chip and the other matching that of the package.
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"Decal with Power/Ground Plane Partitioned by Thermal Coefficient of Expansion" IBM Tech. Discl. Blt. vol. 32, No. 4b, Sep. 1, 1989, pp. 436-437.
"Thermally Compatible Cap/Heatsink Unit" IBM Tech. Discl. Blt. vol. 32, No. 4A, Sep. 1989, pp. 352-353.
Dey Anjan
Genco, Jr. Victor M.
Ryan Patrick
W. L. Gore & Associates, Inc.
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