Method for fabricating a carrier for testing unpackaged semicond

Details Method for fabricating a carrier for testing unpackaged semicond Method for fabricating a carrier for testing unpackaged semicond

1996-03-13

1999-03-09

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29846, 29848, 29856, 324760, 324765, H01R 4300

Patent

active

058784853

ABSTRACT:
A method for fabricating a carrier for testing an unpackaged semiconductor die is provided. The carrier includes a carrier base for supporting the die; an interconnect for establishing a temporary electrical connection with the die; and a force distribution mechanism for biasing the die and interconnect together. In an illustrative embodiment the carrier is formed with a laminated ceramic base. The ceramic base includes internal conductive lines that are wire bonded to the interconnect and metal plated external contacts that are connected to external test circuitry. In an alternate embodiment the carrier is formed with an injection molded plastic base and includes 3-D circuitry formed by a metallization and photolithographic process. In either case, the carrier is adapted for testing different die configurations by interchanging different interconnects.

REFERENCES:
patent: 3780429 (1973-12-01), Friebel et al.
patent: 4236777 (1980-12-01), Merlina et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4312117 (1982-01-01), Robillard et al.
patent: 4417296 (1983-11-01), Schelhorn
patent: 4584767 (1986-04-01), Gregory
patent: 4585991 (1986-04-01), Reid et al.
patent: 4665468 (1987-05-01), Dohya
patent: 4668372 (1987-05-01), Dang et al.
patent: 4689103 (1987-08-01), Elarde
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 4868349 (1989-09-01), Chia
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4926549 (1990-05-01), Yoshizawa et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4946563 (1990-08-01), Yeatts
patent: 4985116 (1991-01-01), Mettler et al.
patent: 5004672 (1991-04-01), D'Ottavio et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5113580 (1992-05-01), Schroeder et al.
patent: 5120391 (1992-06-01), Ishida
patent: 5123850 (1992-06-01), Elder et al.
patent: 5157829 (1992-10-01), Schmidt et al.
patent: 5164336 (1992-11-01), Ohno et al.
patent: 5225037 (1993-07-01), Elder et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5322446 (1994-06-01), Cearley-Cabbiness
patent: 5367253 (1994-11-01), Wood et al.
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5414372 (1995-05-01), Levy
patent: 5419807 (1995-05-01), Akram et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5451165 (1995-09-01), Cearley-Cabbiness et al.
patent: 5456404 (1995-10-01), Robinette, Jr. et al.
patent: 5483174 (1996-01-01), Hembree et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5495179 (1996-02-01), Wood et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5530376 (1996-06-01), Lim et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5543725 (1996-08-01), Lim et al.
patent: 5625944 (1997-05-01), Werther
patent: 5726580 (1998-03-01), Wood et al.
patent: 5819406 (1998-10-01), Yoshizawa et al.
Kirkland, Carl, "What ever happened to molded 3D circuit boards?", Plastics World, pp. 32-36, Feb. 1993.
Cloud et al., Equipment, Processes and Method For High Volume KGD Production, Third Annual Manufacturing Test Conference, Semicon West, 1996 .

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