Method and apparatus for shaping cylindrical electrical parts

Details Method and apparatus for shaping cylindrical electrical parts Method and apparatus for shaping cylindrical electrical parts

1988-10-27

1990-11-06

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156500, 29619, 29841, 29856, 29858, 264259, 264261, 264262, B29C 6570

Patent

active

049683772

ABSTRACT:
A process for transforming a cylindrical electrical part into a component having at least one flat surface, suitable for use as a surface mounted device.

REFERENCES:
patent: 1877352 (1932-09-01), Megow
patent: 2496346 (1950-02-01), Haayman et al.
patent: 3550228 (1970-12-01), Asscher
patent: 3837067 (1974-09-01), Johnston et al.
Handbook of Microelectronics Packaging and Interconnection Technologies, p. 48, et. seq.
Elektronik, "Automatische Bestuckung drahtloser Bauelemente", 12--13--85, Dipl.--Phys. Hartmut Steinberger, pp. 102-106.

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