Magnetron sputter apparatus

Details Magnetron sputter apparatus Magnetron sputter apparatus

1978-11-24

1980-08-26

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

042193974

ABSTRACT:
In a magnetron sputter gun for sputtering cathode material at subatmospheric pressure from a target onto a workpiece, the sputter cathode target comprises a pair of rings disposed in the inner magnetic gap between a pair of axially spaced annular pole pieces of a magnetic circuit. The pair of cathode target rings include a main target ring, which is to receive a preponderance of the cathode erosion, and an auxiliary ring disposed within a counter bore at the inner lip of one of the pole pieces. The main and auxiliary target rings are disposed relative to the counter bored pole piece so as to shape the magnetic field in the region of the sputter target rings such that a nearly constant sputtering rate is attained from the target with constant applied anode to cathode potential and constant current during the time to produce erosion of a preponderance of the volume of the main target ring, whereby a controlled sputtering rate is obtained concurrently with a relatively high utilization of target material.

REFERENCES:
patent: 3878085 (1975-04-01), Corbani
patent: 4060470 (1977-11-01), Clarke
patent: 4100055 (1978-07-01), Rainey
Peter J. Clarke, Ths S-Gun: A Direct Replacement for the Electron Beam Evaporator; Solid State Technology, Dec. 1976, pp. 77-79.

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