Planar magnetron sputtering method and apparatus

Details Planar magnetron sputtering method and apparatus Planar magnetron sputtering method and apparatus

1974-12-16

1976-05-11

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

039560937

ABSTRACT:
A planar magnetron sputtering apparatus is provided with an additional, variable magnetic field normal to and substantially throughout the erosion region of a cathode plate. Application of the foregoing variable magnetic field effects continuous variations in the general location of the points at which magnetic lines of flux are parallel to the cathode plate which correspondingly results in variations in the points of maximum cathode plate erosion. By producing a less acute erosion pattern over a wider cathode plate area, a greater portion of the cathode plate material may be sputtered from any particular planar cathode plate.

REFERENCES:
patent: 3736246 (1973-05-01), Grasenick
patent: 3878085 (1975-04-01), Corbani
J. S. Chapin, "The Planar Magnetron," Vacuum Technology, Jan. 1974, pp. 37-38, 40.

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